Thanks to R&D, S2P will provide new functions and new technologies matching with the markets expectations. Several topics are on going :
- to reduce the tracks and pitch size to be able to solder always smaller components
- to maximise the copper thickness to be able to mix power and signal functions
The industrial trend is to replace current standard components by direct printing of the electronics thanks to organic electronic. We work also on this topic with our historic R&D partner, IPC, and with industrial partners.
